27)Bendong Liu, Yuepeng Hou, Desheng Li and Jiahui Yang. A thermal bubble micro-actuator with induction heating. Sensors and Actuators A. 222(2015), pp 8-14.
26)Bendong Liu, Fangzhou Zhang, Desheng Li, and Jiahui Yang. Research on the Influence of Excitation Frequency on the Sensitivity in Metal Debris Detection with Inductor Sensor. Advances in Mechanical Engineering. Volume 2014, Article ID 790615.
25)Yuepeng Hou, *Bendong Liu, Jiahui Yang. Research on a large power thermal bubble micro‑ejector with induction heating. Microsyst Technol. DOI 10.1007/s00542-014-2367-5, Published online:18 November 2014.
24)Zhang, Fangzhou, Liu, Bendong; Su, Yanqiang; Yang, Jiahui. Research on the detection of metal debris with micro inductive sensor embedded in lubricant. Journal of Chemical and Pharmaceutical Research. v 6, n 7, p 2249-2254, 2014
23)Hou, Yuepeng; Liu, Bendong; Yang, Jiahui; Cai, Ping. The design and realization of micro induction heater for the thermal bubble generation. Key Engineering Materials. v 609-610, p 1239-1247, 2014,
22)Bendong Liu, Fangzhou Zhang, Yude Wu, and Desheng Li. Research on the Detection of Metal Debris with Microplane Inductance Sensor. Advances in Mechanical Engineering. Volume 2013, Article ID 484710, 8 pages. 2013 .
21)Fangzhou Zhang, Bendong Liu, Yude Wu and Desheng Li. The Simulation Research of Detecting Metal Debris with Different Shape Parameters of Micro Inductance Sensor. Advanced Materials Research. Vols. 791-793. pp 861-865. (2013) (EI:20134516955407)
20)Yude Wu, Bendong Liu and Desheng Li. Study on the Inductance of Micro Planar Coil for Eddy Current Detection. Proceedings of 2012 International Conference on Mechanical Engineering and Material Science (MEMS 2012).2012.12. pp 96-99. Shanghai.
19)Bendong Liu, Jiahui Yang and Yude Wu. Study on the Air Damping of the Movable Armature. Key Engineering Materials. Vols. 562-565. pp 1397-1401. (2013) (EI:20133816744831)
18)Yuepeng Hou and Bendong Liu. The Design and Realization of Micro Induction Heater for the Thermal Bubble Generation. 2013 International Conference on Micro-Nano Technology.2013.11.Tianjin.2013. EI
17)Bendong Liu and Desheng Li. Design and Simulation of a Micro Induction Heater. Information: An International Interdisciplinary Journal Vol.13, No.6, November, 2010,pp:2145-2152.(SCI: 000208242700026 IDS: V21YK)
16)Bendong Liu, Desheng Li and Gaofei Deng. The design and simulation of a switch reluctance motor for the transmission auxiliary start up and brake. Advanced Materials Research,Vol. 298 (2011) pp 220-225. (EI:20113514274531)
15)Bendong Liu,Weihan Zhang and Jiahui Yang. The Research of an Energy Recovery Retarder with SRM Structure. 2011 IEEE International Conference on Mechatronics and Automation . pp:1877-81, 2011.(EI:20114614521502)
14)Weihan Zhang, Bendong Liu and Desheng Li. The control system research of paving machine for the modified asphalt coiled material. 2011 IEEE International Conference on Mechatronics and Automation,pp:2433-2437.(EI:20114614521659)
12)Liu Bendong and Li Desheng. The mathematical model and simulation for a micro electromagnetic relay[C].International Conference on Mechatronics and Automation, 2009. ICMA 2009. Page(s): 4720-4724. (EI收錄,ID:20100912743364)
10)Liu Bendong, Li Desheng. The Research on Sacrificial Layer in the Fabrication of Micro Electromagnetic Relay[J],Advanced Materials Research,2009 年,60-61:160-164 (EI 收錄, ID: 10657760).
9)Bendong Liu, DeSheng Li and Xiaobo Yang. Design and Fabrication of a Micro ElectromagneticActuator[C]. Proceedings of the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhuhai, China. 2006: 353-356 (EI收錄, ID: 9473983) .
8) Li Desheng Liu Bendong. Research on Microelectromagnetic relays[J]. Frontiers of Mechanical Engineering in China. 2006(1):111-114.
7)Liu Bendong and Li Desheng. Design and fabrication of a Micro Electromagnetic Relay[C]. 2006 IEEE International Conference on Mechatronics and Automation. Luoyang, China. 2006: 480-484 (EI 收錄, ID: 071710567310).
6)Liu B.D, Guan J.L and Li DSH. The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer[J]. Key Engineering Materials. 2006,305:422-425 (SCI 收錄,ID: 000236491500088) .